In this work, the liquid metal is used as a switch in short fluidic channels. Previously, a microfluidic impedance tuner with a double stub structure has been proposed where the liquid metal is continuously injected into long fluidic channels. ![]() When compared to diode switches, the liquid metal switch provides advantages, such as wider switching range, high power capability, no bias network, and direct current (DC) power consumption, and less parasitic effect. In this paper, we propose a microfluidic impedance tuner while using liquid metal as a switch. Especially, liquid metal in microfluidic channels have been studied for flexible or reconfigurable radio frequency (RF) components, such as filters, sensors, absorbers, antennas, and MEMS switch. It can be implemented at a less complexity and low cost. Microfluidic technology has been developed to carry out analysis, screening, and detection of very small quantities of biomaterial and chemical samples. While circuits with many switching elements can have many tuning points, tuning is obtained at the expense of higher cost and insertion loss. Impedance tuning has been widely studied using active and passive components, such as microelectromechanical systems (MEMS) components or diode varactors. Conventional impedance tuners comprise mainly three different techniques, namely the single-stub, double-stub, and optimization methods. Impedance tuners are widely used to match impedances, such as antennas, power amplifier (PA) load-pull, and noise characterization, and so on. To solve this problem, the use of an impedance tuner is one of the representative methods of matching the antenna impedance. With the advances in the field of wireless communication systems, an increasing number of components are being incorporated in mobile handset design, reducing the space in which complex advanced antennas can be implemented into the handset. In particular, as parts of the human body get closer to the antenna, its performance suffers. Antennas significantly influence the performance of the entire application, as their impedance values vary significantly even in operating environments having small changes. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.The presence of a mismatched impedance between circuits results in an overall degradation in circuit performance impedance matching between circuits is therefore the basis of high frequency electronics. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Infinite array modeling involves one or more antenna elements placed within a unit cell. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. ![]() A candidate array design can examine input impedances of all elements under any beam scan condition.
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